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HongJin-H1851 One-component epoxy resin adhesive

H1851.jpg


Brief introduction


model

HongJin-H1851

Specification30g/branch
characteristic

HongJin H1851 is a one-component epoxy resin adhesive with good flow and workability. At the same time, the product can form excellent bonds between many different types of materials. At the same time, it is a high-temperature-resistant glue that can pass reflow soldering. It can still maintain a good bonding effect when it passes through 260-degree reflow soldering, and its waterproof level can exceed level 4.

Applicable Products

Automotive connectors, mobile phone connectors and various products that require reflow soldering


Technical parameter


Attributes

magnitude

type

epoxy glue

viscosity(at 25°)

6300±1500 (mPa·s) 

density(g/cm3

1.5±0.20 

hardness(Shaw BrothersD)

80+/-10 

Shear force(MPa)(Fe/Fe)

4 Min

water absorption

<1.5% 

Dielectric constant(1MHz)

2.8

surface resistance(Ω)

1.5×1016

Operation time(After opening)

12H


Precautions


1、Please store glue at -20 degrees.

2、Warm up the glue at room temperature for 2 hours before use.

3、Before using glue, use it in small quantities to avoid massive problems. 

4、Before bonding, the bonding surface must be kept clean and free from water, oil, rust, etc. Better after sanding.

5、Baking after dispensing, please strictly follow the conditions recommended in the specification

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